Failure analysis method for semiconductor devices and precision modules

Thorough failure analysis enables high yields, even in contract manufacturing.

1. The Importance of PCBA Failure Analysis

Non-destructive analysis is an important failure analysis method for semiconductor devices, precision modules, and other devices.
Even if a product is disassembled after a failure occurs, it is difficult to reproduce the symptoms or identify the exact location of the failure.
Therefore, we first narrow down the failure location and identify the cause in the product’s original state, and then proceed with physical analysis to determine the true cause.

2. Example of Failure Analysis Procedure

Non-destructive testing begins with an external appearance check.
The presence or absence of stress marks, such as dents or scratches on the product’s periphery, provides important clues.
Next, electrical characteristic analysis is performed to identify open cracks in the semiconductor device, open electrical junctions, shorts, and the exact location of the failure.
Once the problem has been narrowed down to a certain extent through electrical analysis, the internal structure is examined using techniques such as X-rays and SEM observation.
Once the symptoms and location of the failure have been identified, the product is carefully disassembled and physical analysis is performed to determine the cause of the failure.

3. Passing on Failure Analysis Skills

As mentioned above, in addition to the appropriate equipment, failure analysis relies on the insight, reasoning, and intuition of the analyst.

By passing on the skills we have cultivated over our many years of experience, including those of our analysts who investigate the causes of defects and develop countermeasures, we have established a system that enables us to maintain high yields and high quality.